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| 3.0X2.0mm SMD CHIP LED LAMP APK3020MBC BLUE Features !3.0mmX2.0mm SMT LED, 1.3mm THICKNESS. !LOW !WIDE Description The Blue source color devices are made with GaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. !IDEAL !VARIOUS !PACKAGE:2000PCS/REEL Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 1 OF4 Selection Guide Iv (m c d ) @ 20 m A Min . APK3020MBC BLUE (GaN) WATER CLEAR 3 Ty p . 15 V i ew i n g An g l e 21/2 12 0 Par t No . Dic e L en s Ty p e Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Halfwidth Capacitance Forward Voltage Reverse Current Blue Blue Blue Blue Blue Blue D ev i c e Ty p . 430 455 60 65 4.0 4.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA V R = 5V Absolute Maximum Ratings at T)=25C Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operation Temperature Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. B lu e 10 5 30 150 5 -40C To +80C -40C To +85C Un it s mW mA mA V SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 2 OF4 Blue APK3020MBC SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 3 OF4 APK3020MBC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: CDA0404 APPROVED:J.LU REV NO: V.1 CHECKED: DATE: OCT/27/2001 DRAWN:Y.F.XU PAGE: 4 OF4 |
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